leometwu的部落格

Sample Cooling Curves from CE_Computer

CE_Computer Instruction Manual:

      碳%矽%太低了!  C%  and  Si% are way too low!   底炭太低.  

里歐班的同學需弄懂:

Occasional Rugged cooling rate curve is a sign of poor contact of cup. Test results should be discarded because FC number is way too low. Pour another cup right away.

Cooling rate curve (green) is rugged (not smooth)----an indication of poor contact of cup to cup connector. This caused the entire cooling curve to drop 20~30 C, resulting in a much lower FC number than it should have been. Test results should be discarded.

A: wrong position of TL. B: Correct position ( Should be應為 FC270 rather than而非 FC301).  C: slope of  cooling curve before TL is very steep. D: slope of cooling curve after TL is  much gentler than C. From the slope of cooling curve, you should be able to tell which stage of solidification a curve segment represents. 從曲線斜率 要能夠判斷凝固進行是到C, D哪個階段  才算師傅. 有時電腦會研判錯誤, 抓錯初晶或共晶點, 此時人為判定需介入. Human judgement should get in when computer fails to determine TL, TE  correctly.